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研發(fā)設(shè)計(jì)Layout PCB制板SMT貼片元器件代采購(gòu)DIP焊接測(cè)試 噴三防 整機(jī)裝配等一站式服務(wù)
SMT專(zhuān)用名詞中英文對(duì)照表
SMT :surface mount technology 表面貼裝技術(shù)
封裝﹕ Package
貼片﹕ Pick and Place
拆焊﹕ Desoldering
再流﹕Reflow
浸焊﹕ Dip Soldering
拖焊﹕ Drag soldering
印制電路﹕Printed Circuit
印制線(xiàn)路﹕ Printed Wiring
印制電路板﹕ printed circuit board
印制線(xiàn)路板﹕printed wiring board
層壓板﹕laminate
覆銅銅薄層壓板﹕copper-clad laminate
基材﹕base material
成品板﹕production board
印刷﹕printing
導(dǎo)電圖形﹕conductive pattern
印制元件﹕printed component
單面印制板﹕single-sided printed board
雙面印制板﹕double-sided printed board
多層印制板﹕multilayer printed board
電烙鐵﹕ Iron
熱風(fēng)嘴﹕ hot air reflowing noozle
吸錫帶﹕soldering wick
吸錫器﹕tin extractor
焊后檢驗(yàn)﹕post-soldering inspection
目視檢驗(yàn)﹕visual inspection
機(jī)器檢驗(yàn)﹕ machine inspection
焊點(diǎn)質(zhì)量﹕ soldering joint quality
焊電缺陷﹕ soldering jont defect
錯(cuò)焊﹕ solder wrong
漏焊﹕ solder skips
虛焊﹕ pseudo soldering
冷焊﹕ cold soldering
橋焊﹕ solder bridge
脫焊﹕ open soldering
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